Curamik Ceramic Substrates

Our engineers have an international reputation for machining to a very high degree of accuracy.

Curamik ceramic substrates.

These substrates are ideal for applications that demand a long lifetime high power density and robustness. Maruwa rogers curamik coorstek toshiba materials icp technology ferrotec kcc corporation and others currency validating machine market to witness robust expansion by 2026 with top key players like crane payment innovations cummins allison glory global solutions japan cash machine. Contact our sales specialists for further information about curamik advantage. These substrates offer a longer lifetime and greater reliability and performance than alumina substrates and it comes at a competitive price point.

Our curamik power plus substrates are based on zr doped al 2 o 3 hps ceramic. Download the complete technical data sheet with all curamik advantage features. Our curamik ceramic substrates offer high heat conductivity high heat capacity and thermal spreading of the substrates thick copper cladding making our substrates indispensable to power electronics. The low coefficient of thermal expansion of the ceramic substrate means they outperform substrates based on metal or plastic.

Dbc direct bond copper a high tem. Useable area 127 mm x 178 mm 0 05 copper peeling strength 4 0 n mm 50 mm min for dbc with 0 3 mm cu thickness 10 0 n mm 50 mm min for amb with 0 5 mm cu thickness platings electroless ni. Aln ceramic substrates market globally by 2025. At ceramic substrates we operate with a bank of nine cnc s twelve traditional lathes and mills producing fully engineered machinable ceramic components six days a week.

Curamik provides two technologies to attach the substrate with the copper. Our curamik performance substrates are based on si 3 n 4 ceramics joined with copper by active metal brazing amb. 3 µm 7 µm 8 2 p all. The doping process provides enhanced robustness and improved properties when exposed to mechanical constraints.

Curamik high temperature high voltage substrates consist of pure copper bonded to a ceramic substrate such as al2o3 alumina aln aluminum nitride hps zro2 doped or silicon based si3n4 silicon nitride. Curamik ceramic substrates technical data sheet total dimensions master card 138 mm x 190 5 mm 1 5 max. Partial discharge free substrates free of partial discharge for power modules 1 7 kv.